Wink, once the home automation wunderkind, is officially on the market, having filed Chapter 11 bankruptcy along with parent company Quirky, the GE-backed company for inventors. Flextronics International, an electronics OEM giant, has placed the first bid for Wink ($15M for certain assets). The Wink board hopes to close the acquisition process within 60 days.
If two contract electronics providers send their sales people to pitch an OEM prospect. One wears a set of coveralls the other a nice clean suit. Who is the customer going to choose? The loud, forward-charging sales person trying to convince you to buy services, or the sophisticated enabler with knowledge-ready answers to questions about your biggest OEM product or service challenges?
Earlier this year, Microsoft extended its Azure cloud computing platform to the Internet of Things with Azure IoT, a suite of services for enabling smart devices to connect with each other and the cloud. And last week Microsoft lauded the new Crestron Pyng cloud-based home automation platform as an ideal implementation of Azure IoT.During the Microsoft keynote address at Computex Taipei 2015, and in a follow-up blog, Microsoft vice president of worldwide OEM, Nick Parker called Pyng an “elegant home automation technology that utilizes Azure IoT services to connect lighting, shades, audio, thermostats, door locks and security systems, so that everything works together intelligently to make life easier.”
Atmel Corporation (NASDAQ: ATML), a global leader in microcontroller and touch technology solutions, today announced the introduction of its latest Power Line Communication System-on-Chip (SoC) solution designed for smart metering applications.
The Atmel SAM4CP16B is an extension of Atmel’s SAM4Cx smart energy platform built on a dual-core 32-bit ARM(R) Cortex(R)-M4 architecture. Fully compatible with Atmel’s ATPL230A OFDM physical layer (PHY) device compliant with PRIME standard specification, this highly flexible solution addresses OEM’s requirements for various system partitioning, BOM reduction and time-to-market requirements by incorporating independent application, protocol stack and physical layer processing functions within the same device.